AUTOMATIC OPTICAL INSPECTION OF PLATES

AOI

The increasing complexity of the circuit dictated the need for an additional AOI system to allow inspection of the bond and insulation from 25µm. This is offered by the Orbotech Model: Dimension 6 system, which is also able to perform inspection on special contrast materials such as Teflon, Rogers, Polyimide, etc.

Devices:

  • Orbotech Model: Dimension 6
  • Orbotech Model: Fusion 22

Technical characteristics:

  • Maximum working format: 610mm x 762mm (24¨x 30¨)
  • Test plate thickness: 0.025mm – 7.5mm
  • Maximum copper thickness on the tested board: 140µm (4Oz)
  • Verification methods:
    • Triple Vision Technology – three different light spectrums applied according to the contrast of the base material
    • Magic Technology – a software algorithm that reduces the impact of poor CAD design on the panel inspection itself
  • Device capacity: from 25um (1mil) upwards (bond/insulation)
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